深圳市宏博通电子有限公司

SN74LVC1G175的技术资料

来源:深圳市宏博通电子有限公司2009/4/16 15:56:53

SN74LVC1G175的产品特征:
*Available in the Texas Instruments
  NanoStar™and NanoFree™Packages
*Supports 5-V VCC Operation
*Inputs Accept Voltages to 5.5 V
*Max tpd of 4.3 ns at 3.3 V
*Low Power Consumption, 10-µA Max ICC
*±24-mA Output Drive at 3.3 V
*Ioff Supports Partial-Power-Down Mode Operation
*Latch-Up Performance Exceeds 100 mA Per
  JESD 78, Class II
*ESD Protection Exceeds JESD 22
−  2000-V Human-Body Model (A114-A)
−  200-V Machine Model (A115-A)
−  1000-V Charged-Device Model (C101)
  

SN74LVC1G175的技术参数:
Supply voltage range, VCC  . . . . . . . . . . . .  . . . .  −0.5 V to 6.5 V 
Input voltage range, VI (see Note 1) . . . . . . . . . .−0.5 V to 6.5 V 
Voltage range applied to any output in the high-impedance
or power-off state, VO(see Note 1)  . . . . . . . . . . −0.5 V to 6.5 V
Voltage range applied to any output in the high or low state, VO
             (see Notes 1 and 2)  . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . .  . . . . . . . . . . . .. −50 mA
Output clamp current, IOK (VO < 0)   . . . .  . . . . . .. . . . . . −50 mA 
Continuous output current, IO . . . . . . . . .  . . . . . . . . . .  ±50 mA 
Continuous current through VCC or GND  . . . . . .  . . . . .±100 mA 
Package thermal impedance, θJA (see Note 3):
                                             DBV package  . . . . . . . . . .  165℃/W
                                             DCK package  . . . . . . . . . .  259℃/W  
                                             YEP/YZP package . . . . . . . . 123℃/W 
Storage temperature range, Tstg  . . . . . . . . . . . . . −65℃ to 150℃
  

SN74LVC1G175的产品描述:

    This single D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.

    The SN74LVC1G175 has an asynchronous clear (CLR) input. When CLR is high, data from the input pin (D) is transferred to the output pin (Q) on the clock’s (CLK) rising edge. When CLR is low, Q is forced into the low state, regardless of the clock edge or data on D.

    NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.